Process engineering,
at every layer.

We co-develop the front-end and back-end flow against your CD, overlay, and defect-density targets. Module-level recipe sets are tuned against a response-surface DOE, then handed to the line with a yield model that already reflects parametric sensitivity.

Hookup, characterization, and copy-exact qualification carry tools from factory acceptance through first wafer. SPC marathons run against the customer recipe before sign-off so the install is schedule-true and matches OEM spec on day one.

Dedicated engineers stay embedded on the line through the learning curve. Weekly defect Pareto reviews, parametric tuning, and cycle-time engineering compress the path from engineering lots to high-volume manufacturing by quarters.

Predictive maintenance plans, on-site spares pools, and 24/7 customer engineering response protect tool availability and SPC stability. Sustaining engineers feed early-warning data back into the fleet, not just the chamber that failed.

Pareto-driven defect reduction and parametric tuning that pull learning curves forward by quarters, not months. Defectivity baselines, killer-defect kill plans, and parametric tuning loops are tied directly to the SPC stream feeding the fab.

Inline CD-SEM, overlay, and optical control loops hold sub-nanometer alignment across every critical layer. Layer-specific sampling plans feed APC back to lithography in-lot, catching excursions before they reach the next module.

Cross-section, electrical, and accelerated-life analysis close the loop from field return to fab fix. FIB-SEM and physical failure analysis are paired with HTOL and HAST reliability data so root cause is followed all the way back to the recipe.

Process integration and qualification for 2.5D, 3D, and hybrid-bonded stacks runs alongside the front-end flow on the same qualified line. Joint warpage, stack reliability, and HBM-class bonding are characterized against your packaging house spec.